| 1. | Copper conductor paste for thick film hybrid integrated circuits
厚膜混合集成电路用铜导体浆料 |
| 2. | Thin film hybrid integrated circuit
薄膜混合集成电路 |
| 3. | Dielectric paste for multilayer lay out of thick film hybrid integrated circuits
厚膜混合集成电路多层布线用介质浆料 |
| 4. | Thin film hybrid circuit
薄膜混合电路 |
| 5. | Designs , manufactures and markets magnetic components , fuses , delay lines and thick film hybrids
-主要营业项目为各类海棉制品，皮套制品及多种形状海棉加工。 |
| 6. | Semiconductor devices . harmonized system of quality assessment for electronic components . film hybrid integrated circuits . capability approval . sectional specification . specification cecc 63 200
半导体器件.电子元件统一质量评定体系.薄膜混合集成电路.功能认可.分规范 |
| 7. | Chapter 1 and chapter 2 briefly introduce the status of thick film hybrid integrate high frequency devises both domestic and abroad , as well as the circuit and structure of t / r module
第一、二章简要地介绍了厚膜混合集成高频器件的国、内外发展状况及t r组件的电路和结构情况。 |
| 8. | Exploring improved thick film technology and using new materials to improve the thick film high frequency feature is the only way to bring thick film hybrid in 1c to the high frequency application
探索采用厚膜改进型工艺方法及使用新型材料，从而改变其成膜高频特性是唯一能使厚膜向高频方面迈进的必径之路。 |
| 9. | From a viewpoint of system integration and integrated circuit design , in this paper we analyze the design methods , the technology procedure and the design parameter requirements for separate element circuits of a thick film hybrid integrated t / r module
在集成电路设计方面，本文从系统集成的角度出发，比较详细地分析了进行厚膜混合集成t r组件各单元电路的设计方法及工艺实现步骤以及设计参数要求。 |
